DAIS (2021 – 2024)
DAIS (Distributed Artificial Intelligent System) is a 3-year project that aims to develop Intelligent and Secure Edge solutions for the European industry’s supply chain.
The DAIS project focuses on: first, highlighting the European values of self-organization, privacy by design, and low energy use in the Edge Computing components shaping this new era; second, promoting pan-European cooperation to develop the ability to deliver said components at an impactful scale; and finally, displaying these components in key European industrial areas.
Funded by H2020 – ECSEL JU programme of the European Commission (Grant agreement no. 101007273), the project scheduled to be carried out from May 2021 to April 2024 has a budget of €34.7M.
Partners of the project
RISE Research Institutes of Sweden, Schneider Electric, Almende, Danmarks Tekniske Universitet, SIRRIS, Tecnologías, Servicios Telemáticos y Sistemas, Jožef Stefan Institute, Institute of Microelekctronic Applications, Jotne EPM Technology, PDMFC, Expert Analytics, Step Solutions, COSYLAB Laboratorij, TPV trženje in proizvodnja opreme vozil, NXP Semiconductors Netherlands, AnyWi Technology, Danfoss Power Electronics, Technical University of Liberec, Brno University of Technology, Octavic, NXP Semiconductors Germany, Fraunhofer Gesellschaft, Giesecke+Devrient Mobile Security, esc Aerospace, Luebeck University, Sentigrate, Vestel Elektronik Sanayi ve Ticaret, SESTEK Ses ve Iletisim Bilg. Tekn., Akim Metal, Fundación centro tecnolóxico de telecomunicacións de Galicia, University of Cantabria, University of Granada, Technische Universiteit Eindhoven, Seven Solutions, Instituto Tecnológico de Informática, Delft University of Technology, Sensative, Tieto Sweden, Koalatech, Arctos Labs Scandinavia, Beyond Vision, Mälardalen University.
Related products
PowerLogic™ T300
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