Increasing IT chip densities, a focus on energy efficiency, and new IT use cases like harsh edge computing environments are driving the interest and adoption of liquid cooling. In this paper we present the fundamentals of liquid cooling, describe the advantages over conventional air cooling, and explain the 5 main direct to chip and immersive methods. To help guide the selection of the appropriate liquid cooling method for a given need, we explain the key attributes that must be considered.
Files
File Name | ||
VAVR-AQKM3N_R0_EN.pdf
|
|