Welcome to the Schneider Electric corporate Website

Image of Liquid Cooling Technologies for Data Centers and Edge Applications

Liquid Cooling Technologies for Data Centers and Edge Applications

Increasing IT chip densities, a focus on energy efficiency, and new IT use cases like harsh edge computing environments are driving the interest and adoption of liquid cooling. In this paper we present the fundamentals of liquid cooling, describe the advantages over conventional air cooling, and explain the 5 main direct to chip and immersive methods. To help guide the selection of the appropriate liquid cooling method for a given need, we explain the key attributes that must be considered.

Date: 03 Jul 2019 | Type: White paper
Languages: English | Version: V0
Document Reference: SPD_VAVR-AQKM3N_EN

Files

File Name
VAVR-AQKM3N_R0_EN.pdf
Your browser is out of date and has known security issues.

It also may not display all features of this website or other websites.

Please upgrade your browser to access all of the features of this website.

Latest version for Google Chrome, Mozilla Firefox or Microsoft Edgeis recommended for optimal functionality.